Intel Says Not to Say "LGA1851" or "Z890" | MSI vs. ASUS Features & X870E Boards

Intel's Restrictive Practices and New Socket [00:00]

• Intel is implementing controlling measures, preventing the disclosure of socket names such as "LGA 1800" and upcoming chipset names.
• The speaker finds these rules "stupid" and has rejected them, noting that "1800 has been known for a very long time."
• Intel is also preventing the mention of the next chipset's name, which is presented as a mystery and speculated to be revolutionary.
• The company has a history of rebranding numbers and processes, such as moving from 10 nanometer to "Intel 7."
• The speaker infers that Intel is trying to address a "well-known bending and tension problem" with the new socket design, possibly by altering metal components.

Intel's controlling Nature has new highs. They don't want us to tell you that this is called an LGA 1800 socket.

The rules are stupid and I rejected them because 1800 has been known for a very long time now.

Motherboard Innovations: Ease of Installation and Patent Protection [01:34]

• At Computex 2024, new chipsets from Intel and AMD are being released, both in the 800 series.
• MSI and Asus have developed PCIe quick-release mechanisms for graphics cards, with Asus reportedly holding a patent in Taiwan for such a feature, explaining why it wasn't universally adopted earlier.
• These quick-release features are designed to simplify the installation of large modern graphics cards, as traditional release latches can be difficult to access.
• MSI's implementation uses a spring-loaded mechanism, while Asus's might use a cable.
• Other ease-of-installation features include a spring-loaded metal tab for M.2 slots, eliminating the need for multiple screws and heatsink covers.
• This trend towards simplified installation is seen as a way for motherboard vendors to add value.

Anyway that's it's really interesting angle it's why it's taken so on for other board vendors to jump on board make a version of it and that's because they had to figure out a new way to do it.

The whole point of this is to eliminate the 20 screws you sometimes have had to take out for heatsink covers.

CAM Memory Modules and System Design [08:12]

• CAM memory modules represent a new technology with high density but also significant disadvantages.
• Unlike traditional DDR5 slots, CAM modules use a pin array, creating potential RMA nightmares for both manufacturers and users.
• The primary advantage of CAM is improved trace routing due to closer component placement, allowing for higher frequencies and tighter timings.
• A major downside is the loss of the ability to easily expand memory capacity by adding modules later, requiring a complete replacement of the unit.
• These modules have a wider form factor and require screws for installation, along with a substantial cooling cover.

The difference is that because the trace length has to be equal going to the memory module there's areas where they'll have to double up the traces or run basically intentionally longer traces to get equivalent length.

The downside is maybe somewhat obvious that for those who are more enthusiasts you lose the option to just drop in a memory module or two if you want to expand later.

Chipset Naming and Cooler Technology [11:09]

• New chipsets for Intel and AMD will feature familiar naming, with Intel likely using "890" and AMD using "870e" and "870," with AMD continuing its dual-chipset approach for the 870e.
• MSI's cooler is notable for its mounting kit that shifts the cold plate's pressure application point to better accommodate CPU hotspots.
• This shifting is designed to optimize thermal performance by changing the contact patch and highest pressure area.
• The cooler features a rotatable display that aligns with current case design trends and a singular fan unit, which is criticized for creating significant waste if a fan fails.

The there's going to be a mounting kit that shifts where the pressure is applied on the cold plate.

The downside to that is just massive amounts of unnecessary waste if a fan ever dies.

Case Design and Airflow Innovation [13:13]

• The Vel 300R airflow case features a unique dual-fan blade design, with an inner and outer fan spinning in unison, a concept previously seen on graphics cards.
• This design is intended to create a more directed, tornado-like airflow path, theoretically improving cooling by guiding air directly into coolers.
• The case utilizes 160mm fans, which are considered an effective form factor for balancing area with case proportions, avoiding the issues of larger 180mm fans.
• However, the front panel's mesh design has low porosity and a high density of plastic, which is seen as hindering ventilation.
• The ideal improvement suggested is an ultra-fine mesh with a rigid metal version for better airflow and dust filtration.

The idea is that it forms in theory almost more of a tornado of air coming out of the fan that then diffuses at the back end and it's supposed to just direct it more in a straight path.

I am very interested in the fans themselves but the panel we've been talking about for years MSI is slowly improving with this still has some problems though with just low porosity and a really high kind of density of plastic intermixed with that mesh behind it that's going to block a lot of the ventilation.